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ASROCK 6U8X-EGS2 H200 8x GPU Module Without CPU RAM NIC SSD

SKU:6U8X-EGS2
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6U Rackmount with 4+4, 80-PLUS Platinum/Titanium, 3000W CRPS

Dual Socket E (LGA 4677), supports 5th and 4th Gen Intel® Xeon® Scalable Processors

16+16 DIMM slots (2DPC), supports DDR5 RDIMM, RDIMM-3DS

Supports NVIDIA HGX H200 8-GPU with NVIDIA NVSwitch™

8 HHHL PCIe5.0 x16, 5 FHHL PCIe5.0 x16

8 Hot-swap 2.5″ NVMe (PCIe5.0 x4) drive bays, 4 Hot-swap 2.5″ NVMe (PCIe5.0 x4)/SATA drive bays

Supports 1 M.2 (PCIe3.0 x4 or SATA 6Gb/s), 1 M.2 (PCIe3.0 x4)

2 RJ45 (1GbE) by Intel® i350-AM2

Remote management (IPMI)

3-year manufacturer return-to-base parts or replacement warranty included


 

     
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$315,000.00
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Estimate for 682345
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System

Form Factor 6U Rackmount

Dimensions 930 x 448 x 264.7mm (36.6'' x 17.6'' x 10.4'')

Support MB SP2C741D32G-2L+


     System
    Form Factor6U Rackmount
    Dimensions930 x 448 x 264.7mm (36.6” x 17.6” x 10.4”)
    Support MBSP2C741D32G-2L+
     Front Panel
    ButtonsPower button w/ LED, Reset button, NMI button, UID button
    LEDsSystem fault LED, HDD activity LED
    I/O Ports2 RJ45 (1GbE) by Intel i350, shares with Rear IO
    1 dedicated IPMI, shares with Rear IO
    4 Type-A (USB3.2 Gen1)
    1 DB15 (VGA)
     External Drive Bay / Storage
    Front Side Drive Bay8 Hot-swap 2.5″ NVMe (PCIe5.0 x4) drive bays, 4 Hot-swap 2.5″ NVMe (PCIe5.0 x4)/SATA drive bays
    Internal Side1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 2280/22110 form factor [PCH]
    1 M-key (PCIe3.0 x4), supports 2280/22110 form factor [PCH]
     Power Supply
    Type4+4 CRPS
    Output Watts3002.4W @ 220-240Vac input, 2900W @200-220Vac input, 1250W @100-127Vac input
    Efficiency80-PLUS Platinum/Titanium
    AC InputLow-line: 100-127Vrms, 50/60Hz ; High-line: 200-240Vrms, 50/60Hz
     System Fan
    Fan21 PWM Hot-swap 80×80 mm fans
     Processor System
    CPUSupports 5th and 4th Gen Intel® Xeon® Scalable Processors
    SocketDual Socket E (LGA 4677)
    Thermal Design PowerUp to 350W
    ChipsetC741
     System Memory
    Supported DIMM Quantity16+16 DIMM slots (2DPC)
    Supported TypeSupports DDR5 288-pin RDIMM, RDIMM-3DS
    Max. Capacity per DIMMRDIMM: 96GB (2R)
    RDIMM-3DS: 512GB (2S8Rx4)
    Max. DIMM Frequency5600 MT/s (1DPC) / 4400 MT/s (2DPC) on 5th Gen Intel® Xeon® Scalable Processors
    4800 MT/s (1DPC) / 4400 MT/s (2DPC) on 4th Gen Intel® Xeon® Scalable Processors
    *Memory speed and capacity support varies by CPU SKU
    Voltage1.1V
     PCIe Expansion Slots (SLOT7 close to CPU)
    PCIe x 16Rear:
    8 HHHL PCIe5.0 x16
    5 FHHL PCIe5.0 x16
     Ethernet
    Additional GbE ControllerIntel® i350: 2 RJ45 (1GbE)
     Server Management
    BMC ControllerASPEED AST2600
    IPMI Dedicated GLAN1 Realtek RTL8211F for dedicated management GLAN
     Graphics
    ControllerASPEED AST2600
    VRAMDDR4 512MB
     Rear I/O
    UID Button/LED1 UID button
    VGA Port1 DB15 (VGA)
    USB 3.2 Gen1 Port2 Type-A (USB3.2 Gen1)
    RJ452 RJ45 (1GbE) by Intel® i350, shares with Front Panel
    1 dedicated IPMI, shares with Front Panel
     System BIOS
    BIOS TypeAMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
    BIOS FeaturesASRock Rack Instant Flash, ACPI 6.4 and about compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
     Hardware Monitor
    TemperatureCPU, MB, Card side Temperature Sensing
    FanFan Tachometer
    CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjus
    VoltageP0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
     Environment
    TemperatureOperation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
    HumidityNon operation humidity: 20% ~ 90% ( Non condensing)
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