The Lenovo ThinkSystem SR675 V3 is a 3U, dual-socket server powered by 4th Gen AMD EPYC processors, supporting up to 96 Zen 4 cores and a maximum TDP of 360W. This high-performance system can be configured with up to 8 hot-swap drive bays, offering support for 2.5-inch SAS, SATA, or NVMe drives, or up to 6 hot-swap EDSFF drives. With 24 DDR5 DIMM slots, it can deliver up to 3TB of memory using 128GB modules, running at speeds of up to 4800MHz. Optimized for GPU-intensive workloads, the SR675 V3 is compatible with a wide range of NVIDIA data center GPUs, including Hopper, Lovelace, and Ampere, as well as AMD Instinct MI series accelerators, making it an ideal solution for AI, HPC, and advanced computational applications.
This machine can support up to 8x double-wide GPUs including the new NVIDIA H100 and L40 Tensor Core GPUs, or up to 4x SXM5 NVIDIA HGX H100 GPUs with NVLink connecting all GPUs. The NVIDIA HGXTM H100 GPUs' heat is dissipated via a specialized closed-loop liquid-to-air heat exchanger that offers liquid cooling advantages of lower power consumption, quieter operation, and higher performance without requiring additional piping.
Up to 6x SD665 V3 dual node trays can fit inside a single 6U ThinkSystem DW612S enclosure. The enclosure houses up to 144 processors, 216 TB of DDR5 Memory, and up to 144x PCIe Gen5 x16 adapters on just two data center floor tiles with up to 6x chassis in a conventional 42U rack.
Base Module
Up to 4x double-wide, full-height, full-length; FHFL GPUs; PCIe Gen5 x16
Up to 8x 2.5” Hot Swap SAS/SATA/NVMe
Dense Module
Up to 8x double-wide, full-height, full-length GPUs each PCIe Gen5 x16 on PCIe switch
Up to 6x EDSFF E1.S NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
HGX Module
NVIDIA HGXTM H100 4-GPU with 4x NVLink connected SXM5 GPUs
Up to 4x 2.5” Hot Swap NVMe SSDs or up to 4x EDSFF E3.S 1T NVMe HS SSDs
| Component | Specifications |
|---|---|
| Processors | Dual socket, 1x or 2x 4th Generation AMD EPYC processors per node, TDP up to 400W, Up to 96 cores / 192 threads |
| Memory | 24x DDR5 DIMMs, 12 channels per CPU (1DPC), Maximum 3TB using 128GB RDIMMs, Up to 4800 MHz |
| Drive Bays (Per Module) | Base Module: Up to 8x 2.5” hot-swap SAS/SATA/NVMe Dense Module: Up to 6x EDSFF E1.S NVMe SSDs or 4x EDSFF E3.S 1T NVMe HS SSDs HGX Module: Up to 4x 2.5” hot-swap NVMe SSDs or 4x EDSFF E3.S 1T NVMe HS SSDs |
| Power Supplies | Four N+N redundant hot-swap PSUs (up to 2600W Titanium) |
| Cooling | Full ASHRAE A2 support with internal fans, Lenovo Neptune liquid-to-air hybrid cooling on NVIDIA HGX H100 |
| Front Ports | SXM5 model, 4-DW GPU model, and 8-DW GPU model (rear I/O slots): 1x USB 3.1 G1 (5Gb/s), 1x USB 2.0 (XCC management), External diagnostics, VGA 8-DW GPU model (front I/O slots): No front ports |
| Rear Ports | 3x USB 3.1 G1 (5Gb/s), 1x VGA, 1x RJ-45 1GbE (XCC management) Models with rear I/O slots: Optional DB-9 COM serial port |
| Internal Ports | 1x USB 3.1 G1 connector for OS or license key |
| Expansion Slots | Up to 6x PCIe Gen5 x16 adapters (2 front, 4 rear), 1x OCP NIC 3.0 (x16/x8/x4) |
| GPUs | SXM5 model: 4x SXM5 GPUs (@600W/GPU) with Lenovo Neptune cooling, 4x 2.5″ drive bays or 4x EDSFF E3.S 1T NVMe SSDs 4-DW GPU model: 4x double-wide GPUs, 8x 2.5″ drive bays 8-DW GPU model: 8x double-wide GPUs, 6x EDSFF E1.S NVMe SSDs or 4x EDSFF E3.S 1T NVMe SSDs |
| Dimensions | Height: 131 mm (5.2 in), Width: 448 mm (17.6 in), Depth: 892 mm (35.1 in) |
| Weight | SXM5 model: 39.5 kg (87 lb) 4-DW GPU model: 36.7 kg (81 lb) 8-DW GPU model: 39 kg (86 lb) |
| Management | Lenovo XClarity Controller |
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