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Supermicro GPU SuperServer SYS-822GS-NB3RT HGX B300 8-GPU

SKU:SYS-822GS-NB3RT
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Key Applications

  • Scientific Research
  • Conversational AI
  • Business Intelligence & Analytics
  • Drug Discovery
  • Finance Services and Fraud Detection
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI
  • High Performance Computing (HPC)
  • Autonomous Vehicle Technologies

Key Features

  • Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  • 8x B300 Blackwell Ultra SXM GPUs with NVSwitch
  • 8x CX-8 Integrated 800G NICs supporting IB XDR or ETH 2x400GbE per NIC
  • 32x DIMM slots supporting up to 8TB of memory
  • 8x front hot-swap E1.S + 2x M.2 NVMe drive bays
  • 2x PCIe 5.0 x16 FHHL slots
  • 1x USB 3.0, 1x USB 2.0, 1x Mini-DP, 1x BMC/IPMI GbE LAN, 2x 10GbE NIC (X710)
  • 6x redundant (3+3) 6.6kW Titanium level power supplies
  • 8U air-cooled chassis with front I/O

About It

SECURE DEMANDING AI AND HPC WORKLOADS WITH THE SUPERMICRO 8 GPU SUPERSERVER 


The Supermicro GPU SuperServer SYS-822GS-NB3RT HGX B300 8-GPU is a high-density AI and HPC platform built to deliver extreme compute power. It supports dual Intel® Xeon® 6700 series processors (up to 350 W TDP) alongside eight B300 Blackwell Ultra SXM GPUs connected via NVSwitch, enabling massive parallel throughput. The Supermicro HGX B300 is designed for mission-critical reliability in AI training, scientific research, and data analytics environments.

Key Features

  • Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP

  • 8x B300 Blackwell Ultra SXM GPUs with NVSwitch

  • 8x CX-8 Integrated 800G NICs supporting IB XDR or ETH 2x400GbE per NIC

  • 32x DIMM slots supporting up to 8TB of memory

  • 8x front hot-swap E1.S + 2x M.2 NVMe drive bays

  • 2x PCIe 5.0 x16 FHHL slots

  • 1x USB 3.0, 1x USB 2.0, 1x Mini-DP, 1x BMC/IPMI GbE LAN, 2x 10GbE NIC (X710)

  • 6x redundant (3+3) 6.6kW Titanium level power supplies

  • 8U air-cooled chassis with front I/O

     
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$595,000.00
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Key Features
  • Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  • 8x B300 Blackwell Ultra SXM GPUs with NVSwitch
  • 8x CX-8 Integrated 800G NICs supporting IB XDR or ETH 2x400GbE per NIC
  • 32x DIMM slots supporting up to 8TB of memory
  • 8x front hot-swap E1.S + 2x M.2 NVMe drive bays
  • 2x PCIe 5.0 x16 FHHL slots
  • 1x USB 3.0, 1x USB 2.0, 1x Mini-DP, 1x BMC/IPMI GbE LAN, 2x 10GbE NIC (X710)
  • 6x redundant (3+3) 6.6kW Titanium level power supplies
  • 8U air-cooled chassis with front I/O
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